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At CSM Electronics we have over 17 years experience in populating PCB's from both prototype stage, and taking over existing manufacture. In both of these cases the information that we get from our customers is vital to a prompt service and a quality product. Recently CSM has seen a general change in the personnel responsible for outsourcing PCB assembly; this can often lead to a misconception about the ease of changing source of PCB population due to a lack of knowledge of manufacturing processes. Over the years there has also, obviously been an upturn in the use of mixed technologies- smaller more complex boards. The more complex the board, the more amplification the information needs to have. The solution to these scenarios is for CSM to work with our customers to obtain the information required to create the manufacturing pack; thus enabling us to provide an easy transition with a first-rate delivered product.
So what is the basis of a manufacturing pack? The foundation of a manufacturing pack will consist of; Step and repeat (panelised) solder paste layer Gerber- this information is required to create a stencil. Programming data; this is exported from the PCB designing CAD package and contains the X, Y and Z (rotation) co-ordinates of the components. This is used to create the programme for the surface mount machines. Bill of Materials (Parts list); The detail of this needs to be as full as possible, especially if you require a contractor to purchase your components. Assembly Drawing; this drawing will identify the location of the components on the board, will identify any orientation of polarised devices, and will contain any special instructions. Test Requirements; CSM can provide In Circuit test (The board needs to be designed to include test access) or functional test; the manufacturing pack will contain any procedures and equipment required. The manufacturing pack will be fully updated with the processes and any additional information originated by the first time fabrication at CSM to enable consistent repetitive production of the PCB.
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