Manufacturing Guidelines
CSM Electronics likes to be involved in the early stages of development so that we can offer support and advice on our manufacturing guidelines, which may help you keep costs and manufacturing time to a minimum.
Below is a list of useful tips.
- Use FR4 material where possible for printed circuit boards
- Use tooling borders and fiducials for accurate placement. (CSM specifications available on request)
- Use extra fiducials for any fine pitch device
- Vias need to be at least 10 thou from pad with solder resist surround
- Do make break off points sub flush
- Do incorporate 'Design For Test'
- Do put test points on every node
- Component pin 1 should be top right for North up position
- Try to keep your components single sided
- If double sided board, try to keep IC's and bulky components on one side and passives on the other
- If your PCB includes conventional and surface mount, try to keep them on the same side. This enables us to wave solder the board in one operation
- Leave areas around leaded parts so that they are accessible with a soldering iron
- If the board is wave soldered the vias need to be tented
- Specify particular critical components reflow temperature
- Don't mount small components next to large
- Don't reverse boards within a panel
- Do let CSM Electronics prototype the board and provide free feedback
This list is not exhaustive and relates to CSM Electronics specifications.
© CSM Electronics Ltd. Units 6-9 Sandford Lane Ind. Est. Wareham, Dorset, BH20 4DY England Tel: 01929 554 099
www.intergage.co.uk
