The Ersascope offers a cross-sectional, non-destructive visual image of hidden solder joints. With images from practically any angle, and with enormous magnification range the Ersascope is an effective method for inspecting all types of BGA, microBGA and flip-chip components in addition to many other applications, e.g. interior fillets of PQFP and PLCC components.
The system can measure height, width, radius and angles. Exact solder paste print shape, height and volume extend the capability of the system.
Images of the Ersascope can be provided to our customers in electronic format. One of our skilled operatives of the Ersascope will then advise our customer of the appropriate course of action.
CSM Electronics also offers Ersa rework.
