The CSM Ersascope offers a cross-sectional, non-destructive visual image of hidden solder joints ideal for fine pitched devices.The CSM Ersascope offers a cross-sectional, non-destructive visual image of hidden solder joints ideal for fine pitched devices.
With images from practically any angle and with enormous magnification range, the Ersascope is an effective method for inspecting all types of BGA, microBGA devices. It can also be used to check interior fillets of PQFP and PLCC components.
The versatile system can measure height, width, radius and angles, and, it can also measures exact solder paste print shape, height and volume.
Images from the Ersascope can be provided to our customers in electronic file format, in camera or video and CSM's skilled operatives can advise on the most appropriate course of action, whether to rework, reflow, or repair, etc.
CSM Electronics includes this service as part of our comprehensive rework facility, especially for fine pitch devices and BGA's.
