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The X-tek X-Ray is recognised as one of the most advanced non-destructive inspection techniques. Hidden or buried features, such as voiding, porosity, IC die and wire bonding, internal seals, solder joints etc. can be analysed inside all metal, plastic and ceramic packaging. The Ersascope offers a cross-sectional, non-destructive visual image of hidden solder joints. With images from practically any angle and with an enormous magnification range, the Ersascope is a user-friendly effective method for inspecting all types of BGA, microBGA, and flip-chip components, in addition to many other applications, e.g. interior fillets of PQFP and PLCC components. The Diagnosys Scanpoint uses CAD data to automatically optically inspect all components for placement, value, correctness, type, colour differences, short circuits and dry joints. This is a cost effective way to inspect all populated boards. As with all of our services these are offered as part of our manufacturing process or as an independent service. (Quotations available on request.) CSM Electronics is open from Monday to Thursday 8am-5pm and Friday 8am-1pm. For further information please contact Jessica Amos on 01929 554099 |
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