- Placement Rate: 4,000 parts/ hour
- Component Range: 0603 - Most IC's except QFP's
- Maximum Board Size: 649x406
Philips CSM 60 Glue 1 machine
- Placement Rate: 2,700 parts/ hour
- Component Range: 0603 - most IC's except QFP's & Glue Head
- Maximum Board Size: 649x406
Philips CSM 60 Vision 3 machines
- Placement Rate: 4,000 parts/ hour
- Component Range: 0603 - Any IC's including BGA's
- Maximum Board Size: 649x406
Philips Topaz X 1 machine
- Placement Rate: 20,000 parts/ hour
- Component Range: 0201 - 45mm Fine Pitch & BGA's
- Maximum Board Size: 460x440
Panasonic MPA 3 4 machines
- Placement Rate: 7,000 parts/ hour
- Component Range: Any
- Maximum Board Size: 508x373
Panasonic MSH 2 3 machines
- Placement Rate: 40,000 parts/ hour
- Component Range: 0402 - 100 pin QFP
- Maximum Board Size: 250x330
Panasonic MV2F 3 machines
- Placement Rate: 36,000 parts/ hour
- Component Range: 0402 - QFP
- Maximum Board Size: 508x373
Other Manufacturing Equipment
Printers
- 1 Panasonic MPM AP 24 - 2D Inspection
- 2 Panasonic MPM AP 25 - 2D Inspection
- 3 Panasonic MPM UP 3000 Hie - 2D Inspection
- 1 KisTech
Precision Placement & Rework Station : ErsaScope
- 1 Ersascope - typically used for BGA's
- 1 IR550A - Ersa Rework System
- 1 PL500A - Precision Placement & Inspection System
Test Equipment
- 3 Spea E500AD In-Circuit Tester
- 1 Spea E100AD In-Circuit Tester
- Functional Test Capability (ATE)
Inspection Equipment
- 2 DiagnoSYS Scanpoint AOI (Automated Optical)
- 1 Tek X-ray
- Various Magnification Equipment
- 1 Ersascope (BGA's)
Reflow Ovens
- 1 DIMA 0406 Chain
- 1 QUAD ZCR
- 1 QUAD SIGMA FLOW
- 1 QUAD QRS
- 1 QUAD QCR
- 1 IBL SC L604 Vapour Phase Reflow
Wave Solder
- CMS 400 Blundell Wave Solder Machine (Lead)
- CMS 400 Blundell Wave Solder (P/B, RoHS, Lead free)
Automated Conformal Coating
- Century C-T40 Asymtek : Selective coating from 3,6,10mm+
|
