CSM Electronics embraces mixed tecnologies
Over the past few years CSM has seen the mix of technologies on PCB's increase, with RoHS compliance coming into force, we want to ensure that we can provide the best service to our customers.
CSM have made investments to support the dynamics of our customers.
Vapour Phase
As the Perfluorinated fluid boils, a layer of saturated vapour containing no oxygen or other gasses forms above it. The vapour provides a 100%inert gas atmosphere.
As the solder material is immersed into the vapour zone the vapour condenses onto it and transfers its corresponding heat.
It is impossible to heat components to a higher temperature than the condensing vapour. The maximum reflow peak is set by the boiling point of the fluid. In fact the Delta T is less than 5°C.
With the profiling software the Vapour Phase is a more controllable reflow process ideal for complex RoHS compliant boards.
Philips Topaz X machine with 0201 capability
The machine has the capacity to place 20,000 components per hour, with an accuracy of 35 microns @ 3 Sigma and will be used in conjunction with one of our 10 lines to enable us to give full population cover.
DiagnoSYS ScanPoint AOI
The requirement to perform AOI, not only in house, but as a stand alone service has been well received, to support the demand; we have now invested in our 2nd machine.
Mixed technology boards continue to be supported by our existing equipment, a reminder of which is below.
o Ersascope
o X-ray
o Ersa rework
o AOI
o ICT
o Functional Test
o 10 SM lines placing from 0201-micro BGA
o Through hole activity
o Final Assembly
o Conformal Coat
CSM has also purchased our 4 units in Wareham, Dorset, totalling over 15,000 sq ft. We have occupied the building(s) for over 15 years.
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