The X-Tek X-Ray is recognised as one of the most advanced non-destructive inspection techniques. Hidden or buried features, such as voiding, porosity, IC die and wire bonding, internal seals, solder joints etc. can be analysed inside all metal, plastic and ceramic packaging.
Our skilled staff analyse the X-Ray and confirm the diagnosis with our customer. We can then advise the use of one of our rework techniques to provide our customers with a full service.
