The X-Tek X-Ray is one of the most recognised Non-Destructive inspection Techniques available to inspect fine pitched BGA's. Hidden or buried features such as voiding, porosity, IC die and wire bonding, internal seals, solder joints etc. inside metal, plastic and ceramic packaging, become visible and can be analysed.
X-Rays can provide valuable information not available from any other format. It is ideal for checking BGA Reflow operations and internal tracking on flash drives, to name but a few.
CSM also offer X-Ray services as a stand-alone facility to aid customers who may be experiencing problems with faulty devices, suspect quality issues, or even to determine whether components are genuine.
Skilled staff analyse the X-Rays and can provide photographic images. CSM will also advise on the most appropriate rework techniques available and give a competitive price at all times.
